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Wafer bonding
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#	Item
11	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:24:22 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
12	F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Electronic Packaging & System Integration Invisible – Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 05:52:04 Technology Wafer bonding Integrated circuit packaging Reliability Flip chip Wafer Etching EV Group Three-dimensional integrated circuit Semiconductor device fabrication Microtechnology Electronics
13	70 Technology focus: Photovoltaics GaAs/InP wafer bonding with low electrical resistance Researchers see good prospects for room-temperature wafer bonding process in multi-junction solar cell applications. Add to Reading List Source URL: www.semiconductor-today.com Language: English - Date: 2015-01-23 09:11:32 Solar cells Energy conversion Semiconductor device fabrication Optoelectronics Ohmic contact Solar cell Wafer Gallium arsenide Multijunction photovoltaic cell Chemistry Semiconductor devices Technology
14	FRAUNHOFER-INSTITUT FÜR ZUVERLÄSSIGKEIT UND MIKROINTEGRATION J OIN THE T EAM ! Job opportunities @ Fraunhofer IZM-ASSID in Dresden/Moritzburg WHO WE ARE: Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-08 14:28:22 Materials science Fraunhofer Society Wafer bonding Through-silicon via Wafer Deep reactive-ion etching Semiconductor device fabrication Microtechnology Electronics
15	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:01:57 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
16	Departure board at Asian airport Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-07 20:12:35 Technology Chemistry Wafer bonding Joseph von Fraunhofer Ambient intelligence Fraunhofer Fraunhofer Additive Manufacturing Alliance Fraunhofer Group for Microelectronics Fraunhofer Society Science
17	High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market Russell Shumway Director- MEMS & Sensor Products Office: Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:45:23 Semiconductor device fabrication Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Wafer bonding Flip chip Deep reactive-ion etching Amkor Technology Materials science Technology Microtechnology
18	PCN Number: Title: PCN Date: Add to Reading List Source URL: media.digikey.com Language: English - Date: 2013-05-06 15:04:16 Chemistry Reliability Wafer Small-outline integrated circuit Copper Wire bonding National Semiconductor Semiconductor device fabrication Technology Electronic engineering
19	PCN Number: Title: 20130306001A PCN Date: Add to Reading List Source URL: media.digikey.com Language: English - Date: 2013-07-30 10:24:07 Microtechnology Reliability Copper Small-outline integrated circuit Wire bonding Wafer Semiconductor device fabrication Technology Chemistry
20	A new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding Add to Reading List Source URL: deepblue.lib.umich.edu Language: English - Date: 2013-09-17 15:11:17 Technology Microelectromechanical systems Etching Wafer Microfabrication Deep reactive-ion etching Chemical-mechanical planarization Thermal oxidation Silicon on insulator Semiconductor device fabrication Materials science Microtechnology